Modern Electronic Packaging Technology
نویسندگان
چکیده
A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protection. Each packaging level reflects a trade-off among many interrelated factors including design requirements, economics, and manufacturing infrastructure. (
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